Crystalline Mirror Solutions

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The new gold standard
in customized bonding services

Fully customized solutions for direct-bonded components

Using our proprietary direct bonding technology, CMS offers xtal custom™ services for the heterogeneous integration of any number of disparate material systems. With this interlayer- and stress-free process, we can fuse a wide variety of materials in the form of bulk components, wafers, or chips. Please contact us to discuss a solution for your specific requirements.

Example applications made possible or improved by direct bonding:

  • Semiconductor active regions on SiC and diamond for thermally-optimized saturable absorbers and high-power emitters
  • Electrically-conductive interface layers between single-crystal semiconductors
  • Laser disks directly bonded to polished heat sink materials
  • Buried dielectric layers between single-crystal materials and thin films
  • Integration of non-lattice-matched semiconductor heterostructures
  • Semiconductor films on “soft” materials
  • Joining dielectric and semiconductor layers for silicon and integrated photonics
  • Simplify manufacturing by eliminating film stress
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    Example materials

    Fused silica
    Sapphire
    Ti: Sapphire
    GaAs
    SiC
    Diamond
    Si
    YAG
    YV0₄
    and more

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    Size

    <5 mm to

    200 mm

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    Thickness

    < 1 µm

    30 mm

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    Radius of curvature

    planar substrates

    10 cm

Custom Geometries

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Please leave us a note with your name, email, and areas of interest. We will follow-up as soon as possible.

Carret